high density interconnect pcb (170) 온라인 제조업체
Bend Radius: 0.5-10mm
Components: SMD, BGA, DIP, Etc.
원료: FR4 IT180
판 두께: 0.2mm-6.00 mm(8mil-126mil)
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Max Layer: 52L
Pcb Layer: 1-28layers
Thickness Of Copper: 0.5-14oz (18-490um)
Pcb: Single,double,multilayer Pcb,custom Pcb
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