electronic circuit board (365) 온라인 제조업체
Key Words: High Density Interconnector
판 두께: 0.2mm-6.00 mm(8mil-126mil)
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
내부 레이어 간격: 0.15 밀리미터
두께: 0.4-3.2mm
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Surface Mount Technology: Available
Vip Process: Yes
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
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