Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
두께: 0.4-3.2mm
눈 먼 길 과 묻힌 길: 사용 가능
내부 레이어 간격: 0.15 밀리미터
두께: 0.4-3.2mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Base Material: Aluminum Base,CUSTOM
Withstand Voltage: >3KV
Withstand Voltage: >3KV
Base Material: Aluminum Base,CUSTOM
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