high density interconnect pcb (174) 온라인 제조업체
Bend Radius: 0.5-10mm
Components: SMD, BGA, DIP, Etc.
원료: FR4 IT180
판 두께: 0.2mm-6.00 mm(8mil-126mil)
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Pcb Standard: IPC-A-610 D
Lead Time: 5-7 Working Days
Max Layer: 52L
Pcb Layer: 1-28layers
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