rogers pcbs (40) 온라인 제조업체
Surface Mount Technology: Available
Vip Process: Yes
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Key Words: High Density Interconnector
Feature: Immersion Silver
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
두께: 0.4-3.2mm
눈 먼 길 과 묻힌 길: 사용 가능
Finished Copper Thickness: 1oz
Silkscreen: White, Black, Yellow, Etc.
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
구멍 크기: 0.2 밀리미터
맥스. 패널 사이즈: 600mm*1200mm
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