electronic circuit board (365) 온라인 제조업체
Special Technology: Standard
Special Requirement: Halogen Free/impedance Control
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
특수한 요구 사항: 멀티클래스 임피던스
표면 실장 기술: 그래요
Packing: Vacuum Packing With Carton Box
Surface Treatment: Immersion Gold
Surface Finishing: HASL,OSP,ENIG,Immersion Gold,lead Free
Min. Hole To Copper: 0.2mm
Conductor Space: 5 Mil
Surface Finishing: HASL,OSP,ENIG,Immersion Gold,lead Free
민. 환형 링: 3mil
레이어 총수: 모든 계층
Type: Copper Clad Laminate
Tensile Strength: Excellent,>300Mpa,1.2~1.6N/mm
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