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How to Clean PCBA with Ultrasonic Cleaning Technology

2025-12-22

에 대한 최신 회사 뉴스 How to Clean PCBA with Ultrasonic Cleaning Technology

 

  • Key Takeaways
  • Understanding Ultrasonic Cleaning for PCBA
  • The Ultrasonic Cleaning Process for PCBA
  • Key Factors in Effective Ultrasonic PCBA Cleaning
  • Types of Contaminants and Cleaning Solutions
  • LTPCBA's Expertise in Ultrasonic PCBA Cleaning
  • FAQ

Key Takeaways

  • Ultrasonic cleaning removes PCBA contaminants (flux residue, solder balls) with 99.9% efficiency using 40–80kHz sound waves.
  • Optimal cleaning parameters: 50–60°C temperature, neutral pH cleaners, and 10–15 minute cycles.
  • LTPCBA employs automated ultrasonic systems to achieve IPC-A-610 Class 3 cleanliness standards for medical/aerospace PCBs.

Understanding Ultrasonic Cleaning for PCBA

What Is Ultrasonic Cleaning?

Ultrasonic cleaning uses high-frequency sound waves (40–80kHz) to create cavitation bubbles, which implode to dislodge contaminants from PCBA surfaces. Key advantages:

  • Reaches complex geometries (BGAs, fine-pitch components).
  • Non-destructive to delicate components (unlike manual scrubbing).

Industry Applications

 

Sector Cleaning Requirements
Medical Biocompatible cleaners for implantable devices
Aerospace Zero-residue standards for high-reliability systems
Automotive Removal of flux and thermal compound residues
Consumer Electronics Cost-effective bulk cleaning for mass production

The Ultrasonic Cleaning Process

Pre-Cleaning Preparation

  • Component Protection:
    • Mask sensitive parts (e.g., connectors) with waterproof tape.
    • Verify component temperature tolerance (≥60°C for standard components).

Core Cleaning Stages

  • Degreasing: Removes oils and fingerprints using aqueous cleaners.
  • Ultrasonic Agitation:
    • Frequency: 40kHz for general cleaning; 80kHz for fine-pitch components.
    • Power Density: 1–2 W/cm² for optimal cavitation.
  • Rinsing: Deionized water flushes away dislodged contaminants.
  • Drying: Hot air (60–80°C) or vacuum drying to prevent water spots.

Post-Cleaning Inspection

  • White Light Microscopy: 10–50x magnification to check for residual flux.
  • Surface Insulation Resistance (SIR) Test: IPC-9202 compliance (≥10⁹ ohms).

Key Factors in Effective Cleaning

Equipment Selection

 

Equipment Type Feature Cost Range
Benchtop Ultrasonic 3–10L tank, manual operation 500–2,000
In-Line Automated Conveyor-based, multiple tanks 50,000–150,000
High-Frequency System 100–400kHz for nano-scale cleaning $100,000+

Process Parameters

  • Temperature Impact:
    • 50–60°C: Maximizes cleaner effectiveness without damaging components.
    • <50°C: Reduced cavitation; >60°C: Potential flux reflow.
  • Cycle Time: 10–15 minutes balances cleaning efficiency and cost.

Cleaning Solution Selection

Cleaner Type pH Range Application Suitability
Aqueous 7–9 General-purpose flux removal
Semi-Aqueous 5–7 No-clean flux residues
Solvent-Based 6–8 Heavy grease and thermal paste

Types of Contaminants and Solutions

Common PCBA Contaminants

 

Contaminant Source Risk Level
Flux Residue Soldering process High (corrosion risk)
Solder Balls Excess solder during reflow Medium (short circuit risk)
Fingerprints Handling Low (oxidation risk)
Flux Vapors High-temperature soldering Medium (insulation degradation)

Solution-Contaminant Matching

 

Contaminant Recommended Cleaner Contact Time
Rosin-Based Flux Citrus-based aqueous 5–8 minutes
Water-Soluble Flux Alkaline aqueous 3–5 minutes
No-Clean Flux Isopropyl alcohol (IPA) 2–3 minutes

LTPCBA's Ultrasonic Cleaning Expertise

Advanced Equipment

  • In-Line Ultrasonic Systems:
    • Tank Capacity: 50–100L for high-volume production.
    • Frequency: 40kHz/80kHz dual-mode for versatile cleaning.
  • Quality Control Tools:

 

Tool Function
SIR Tester Measures insulation resistance
Ion Chromatography Analyzes ionic contamination
FTIR Spectroscopy Identifies organic residues

Industry-Specific Solutions

  • Medical Devices:
    • Cleaners: Non-ionic surfactants (biocompatible).
    • Validation: ISO 13485 compliance with 100% SIR testing.
  • Aerospace:
    • Process: Nitrogen drying to prevent oxidation.
    • Standard: MIL-P-28809 for zero-residue requirements.

Performance Metrics

 

Metric LTPCBA Standard
Residue Density <0.5μg/cm²
SIR Value ≥10¹⁰ ohms
First Pass Yield 99.5%

FAQ

  • What's the optimal frequency for PCBA ultrasonic cleaning?40kHz for general applications; 80kHz for fine-pitch components (0.5mm pitch and below).
  • Can ultrasonic cleaning damage sensitive components?No, when parameters are controlled (temperature <60°C, power density <2W/cm²). LTPCBA pre-tests component tolerance.
  • How to choose between aqueous and solvent cleaners?Aqueous for water-soluble fluxes; solvent-based for tough residues like thermal compounds. Consult LTPCBA for material compatibility.

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